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  Datasheet File OCR Text:
 HiPerFETTM Power MOSFET
Single Die MOSFET
Preliminary data sheet Symbol Test Conditions
VDSS
ID25 55A 50A 55A 50A
RDS(on) 80m 100m 80m 100m
trr 250ns 250ns 250ns 250ns
IXFN IXFN IXFK IXFK
55N50 50N50 55N50 50N50
500V 500V 500V 500V
IXFK 55N50 500 500 20 30 55 220 55 60 5 560
Maximum Ratings IXFK IXFN 50N50 55N50 500 500 20 30 50 200 50 55 220 55 60 5 600 -55 ... +150 150 -55 ... +150
TO-264 AA (IXFK) IXFN 50N50 V V V V 50 A 200 A 50 A mJ V/ns
D S G D S
VDSS VDGR VGS VGSM ID25 IDM IAR EAR dv/dt PD TJ TJM Tstg TL VISOL Md Weight
TJ = 25C to 150C TJ = 25C to 150C Continuous Transient TC = 25C T C =25C, TC = 25C TC = 25C IS IDM, di/dt 100 A/s, VDD VDSS TJ 150C, RG = 2 TC = 25C
D (TAB)
miniBLOC, SOT-227 B (IXFN) E153432 S
G
W C C C C V~ V~ G = Gate S = Source D = Drain TAB = Drain
Either Source terminal at miniBLOC can be used as Main or Kelvin Source
1.6 mm (0.063 in) from case for 10 s 50/60 Hz, RMS IISOL 1 mA t = 1 min t=1s
300 N/A N/A 0.9/6 N/A 10
N/A 2500 3000
Mounting torque Terminal connection torque
1.5/13 Nm/lb.in. 1.5/13 Nm/lb.in. 30 g
Symbol Test Conditions (TJ = 25C, unless otherwise specified)
VDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 1mA VDS = VGS, ID = 8mA VGS = 20V; VDS = 0V VDS = VDSS VGS = 0 V VGS = 10 V, ID = 0.5 * ID25 Note 1
Characteristic Values Min. Typ. Max.
500 2.5 4.5 200 TJ = 25C TJ = 125C 55N50 50N50 25 2 80 100 V V nA A mA m m
Features * International standard packages * Encapsulating epoxy meets UL 94 V-0, flammability classification * miniBLOC with Aluminium nitride isolation * Low RDS (on) HDMOSTM process * Rugged polysilicon gate cell structure * Unclamped Inductive Switching (UIS) rated * Low package inductance * Fast intrinsic Rectifier Applications * DC-DC converters * Battery chargers * Switched-mode and resonant-mode power supplies * DC choppers * Temperature and lighting controls Advantages * Easy to mount * Space savings * High power density
(c) 2002 IXYS All rights reserved
97502F (04/02)
IXFK50N50 IXFN50N50
Symbol Test Conditions (TJ = 25C, unless otherwise specified) gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK RthJC RthCK TO-264 AA TO-264 AA miniBLOC, SOT-227 B miniBLOC, SOT-227 B 0.05 0.15 0.21 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 VGS = 10 V, VDS = 0.5 * VDSS, ID = 0.5 * ID25 RG = 1 (External), VGS = 0 V, VDS = 25 V, f = 1 MHz VDS = 10 V; ID = 0.5 * ID25 Note 1 Characteristic Values Min. Typ. Max. 45 9400 1280 460 45 60 120 45 330 55 155 0.22 S pF pF pF ns ns ns ns nC nC nC K/W K/W K/W K/W
A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T Dim.
IXFK55N50 IXFN55N50
TO-264 AA Outline
Millimeter Min. Max. 4.82 5.13 2.54 2.89 2.00 2.10 1.12 1.42 2.39 2.69 2.90 3.09 0.53 0.83 25.91 26.16 19.81 19.96 5.46 BSC 0.00 0.25 0.00 0.25 20.32 20.83 2.29 2.59 3.17 3.66 6.07 6.27 8.38 8.69 3.81 4.32 1.78 2.29 6.04 6.30 1.57 1.83
Min.
Inches Max.
.190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072
Source-Drain Diode (TJ = 25C, unless otherwise specified) Symbol Test Conditions IS ISM VSD t rr QRM IRM IF = 25 A, -di/dt = 100 A/s, VR = 100 V VGS = 0 Repetitive; pulse width limited by TJM IF = 100 A, VGS = 0 V 55N50 50N50 55N50 50N50 Note 1
Characteristic Values Min. Typ. Max. 55 50 220 200 1.5 250 1.0 10 A A A A V ns C A
miniBLOC, SOT-227 B
M4 screws (4x) supplied
Dim. A B C D Millimeter Min. Max. 31.50 7.80 4.09 4.09 4.09 14.91 30.12 38.00 11.68 8.92 0.76 12.60 25.15 1.98 4.95 26.54 3.94 4.72 24.59 -0.05 31.88 8.20 4.29 4.29 4.29 15.11 30.30 38.23 12.22 9.60 0.84 12.85 25.42 2.13 5.97 26.90 4.42 4.85 25.07 0.1 Inches Min. 1.240 0.307 0.161 0.161 0.161 0.587 1.186 1.496 0.460 0.351 0.030 0.496 0.990 0.078 0.195 1.045 0.155 0.186 0.968 -0.002 Max. 1.255 0.323 0.169 0.169 0.169 0.595 1.193 1.505 0.481 0.378 0.033 0.506 1.001 0.084 0.235 1.059 0.174 0.191 0.987 0.004
Notes: 1. Pulse test, t 300 s, duty cycle d 2 %
E F G H J K L M N O P Q R S T U
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 6,306,728B1
IXFK50N50 IXFN50N50
Figure 1. Output Characteristics at 25OC
TJ = 25OC VGS = 10V 9V 8V 7V 6V
IXFK55N50 IXFN55N50
Figure 2. Output Characteristics at 125OC
100
TJ = 125OC VGS = 10V 9V 8V 7V 6V
140 120
80
ID - Amperes
ID - Amperes
100 80 60 40 20 0
60
5V
40 20 0
5V
0
4
8
12
16
20
24
0
4
8
12
16
20
24
VDS - Volts
VDS - Volts
Figure 3.
2.8
VGS = 10V
RDS(on) normalized to 0.5 ID25 value vs. ID
2.2 2.0 1.8 1.6 1.4
Figure 4. RDS(on) normalized to 0.5 ID25 value vs. TJ
VGS = 10V
RDS(ON) - Normalized
2.0 1.6
TJ = 125OC
RDS(ON) - Normalized
2.4
ID = 55A
TJ = 25OC
1.2 0.8
ID = 27.5A
1.2 1.0 25
0
20
40
60
80
100
120
50
75
100
125
150
ID - Amperes
TJ - Degrees C
60 50
Figure 5. Drain Current vs. Case Temperature
100
IXF_55N50
Figure 6. Admittance Curves
80
ID - Amperes
IXF_50N50
ID - Amperes
40 30 20 10 0
TJ = 125oC
60 40 20 0 3.0
TJ = 25oC
-50
-25
0
25
50
75
100 125 150
3.5
4.0
4.5
5.0
5.5
6.0
TC - Degrees C
(c) 2002 IXYS All rights reserved
VGS - Volts
IXFK50N50 IXFN50N50
Figure 7. Gate Charge
12 10
VDS = 250V ID = 27.5A
IXFK55N50 IXFN55N50
Figure 8. Capacitance Curves
10000
Ciss
f = 1MHz
Capacitance - pF
VGS - Volts
8 6 4 2 0
Coss
1000
Crss
0
50
100
150
200
250
300
350
100
0
5
10
15
20
25
30
35
40
Gate Charge - nC
VDS - Volts
Figure 9.
100 80
Forward Voltage Drop of the Intrinsic Diode
ID - Amperes
60 40
TJ = 125OC
20
TJ = 25OC
0
0.2
0.4
0.6
0.8
1.0
VSD - Volts
Figure 10. Transient Thermal Resistance
1.00
R(th)JC - K/W
0.10
0.01
0.00 10-4
10-3
10-2
10-1
100
101
Pulse Width - Seconds
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 6,306,728B1


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